Chief Technology Officer (CTO) / Senior Manager, Optical Packaging Engineering

소개

We are seeking a visionary Chief Technology Officer (CTO) or Senior Optical Packaging Engineer to lead the advancement of our polymer-based optical packaging technologies. This strategic leadership role is central to driving innovation in high-performance optical module design, automation, and process development. The successful candidate will spearhead core R&D initiatives, manage cross-functional engineering teams, and play a key role in scaling Lessengers’ manufacturing capabilities in alignment with our global business goals. This role is ideal for a technical leader who thrives in a fast-paced, entrepreneurial environment and is passionate about pioneering next-generation packaging solutions for high-speed optical communication systems.

주요업무

Technology Leadership & Development • Lead the development of polymer-based optical packaging technologies with a strong focus on process automation, precision assembly, and scalability. • Define and oversee technical strategy across packaging design, prototyping, and transition to volume manufacturing. • Act as a key contributor in the development and optimization of high-precision alignment and assembly processes for photonic devices. Team Building & Mentorship • Mentor and train engineering teams in advanced optical packaging techniques using proprietary tools and processes. • Build a high-performance engineering culture driven by innovation, collaboration, and continuous improvement. • Provide leadership at the Gwangju site (preferably as its General Manager), setting direction and ensuring effective operational execution. Cross-Functional Collaboration • Partner with the product development and manufacturing teams to translate design concepts into manufacturable solutions. • Lead technical communication and reporting activities, including the preparation of documentation for customers, industry partners, and internal stakeholders. Quality & Standards Compliance • Ensure engineering practices meet Lessengers’ Quality Management System and safety standards. • Promote rigorous testing, calibration, and validation of packaging processes and optoelectronic assemblies.

자격요건

• Proven experience in optical packaging processes, including: • Fiber array attachment to photonic devices • High-precision alignment, warpage control, and laser coupling • Characterization of optoelectronic devices and silicon photonic ICs • Hands-on experience in developing scalable packaging routines and automation protocols. • Strong understanding of photonic integration and process engineering in a production or prototyping environment.

우대사항

• Ph.D. in Optical Engineering, Photonics, Materials Science, or related discipline with 5+ years of industry experience. • Background in multi-disciplinary teams involving optics, electronics, and automation. • Familiarity with photonic packaging in communication systems and datacenter interconnects. • Experience with optical simulation, mechanical modeling, and systems-level design. • Excellent time and project management skills with a strong execution track record

혜택 및 복지

What We Offer • Strategic leadership role in a company pioneering high-performance optical transceiver technologies for AI/HPC markets. • Opportunity to shape the future of photonic packaging innovation and contribute to global technology leadership. A collaborative, engineering-driven culture committed to solving complex challenges with creativity and speed.